pcb capability
| PCB General Capability | |
| Number of Layer | 1-28Layer |
| Maximum processing area | 680 x 1000 mm |
| Min board Thickness | 2 Layer – 0.3mm(12mil) |
| 4 Layer – 0.4mm(16mil) | |
| 6 Layer – 0.8mm(32mil) | |
| 8 Layer – 1.0mm(40mil) | |
| 10 Layer – 1.1mm(44mil) | |
| 12 Layer – 1.3mm(52mil) | |
| 14 Layer – 1.5mm(59mil) | |
| 16 Layer – 1.6mm(63mil) | |
| 18 Layer – 1.8mm(71mil) | |
| Finished board thickness tolerance | Thickness＜0.8mm, Tolerance:+/-0.08mm |
| 0.8mm≤Thickness≤6.5mm,Tolerance+/-10% | |
| Twisting and bending | ≤0.75% Min0.5% |
| Range of TG | 130-215℃ |
| Impedance tolerance | +/-10%，Min+/-5% |
| Hi-Pot Test | Max4000V/10MA/60S |
| Surface treatment | HASL , With Lead , HASL Free Lead |
| Flash Gold , Immersion Gold | |
| Immersion Silver , Immersion Tin | |
| Gold Finger , Osp | |
| PCB Cu thickness +plating | |
| Out layer Cu thickness | 1-6 OZ |
| Inner layer Cu thickness | 0.5-4 OZ |
| Cu thickness of PTH | average>=20um |
| Min.>=18um | |
| HASL with lead | Tin 63% Lead37% |
| HASL free lead | surface thickness>=0075um |
| Thickness in the hole>=5um | |
| Flash Gold | Ni thickness:3-5um (120u”-160u”) |
| Gold thickness:0.025-0.075um （1u”-3u”） | |
| Immersion Gold | Ni thickness:3-5um (120u”-160u”) |
| Gold thickness:0.025-0.15um （1u”-6u”） | |
| Immersion Tin | Tin thickness:0.8-1.2um（32u”-48u”） |
| Immersion silver | Ag thickness:0.15um-0.75um (6u”-30u”) |
| Gold Finger | Ni thickness:3-5um（120u”-160u”） |
| Gold thickness:0.025-1.51um（1u”-60u”） | |
| PCB Pattern limit Capacability | ||
| Min width | 0.1mm (4 mil) | |
| Min trace | 0.1mm (4 mil) | |
| Min width of ring (inner layer) | 0.15mm (6 mil) | |
| Min width of ring (out layer) | 0.1mm (4 mil) | |
| Min solder bridge | 0.1mm (4 mil) | |
| Min height of legend | 0.7mm (28mil) | |
| Min width of legend | 0.15mm (6 mil) | |
| PCB Holes processing Capacability | ||
| Final hole size | Min 0.2mm | |
| Drilling hole size | 0.20~6.5mm | |
| Drilling tolerance | +/-0.05mm | |
| Final hole size tolerance (PTH) | φ0.20~1.60mm+/-0.075mm | |
| φ1.60~6.30mm: +/-0.10mm | ||
| Final hole size tolerance (NPTH) | φ0.20~1.60mm+/-0.05mm | |
| φ1.60~6.50mm: +/-0.05mm | ||
| Drilling strip hole | Length /width 2:1 | |
| Min strip hole width 0.65mm | ||
| Length & width tolerance +/-0.05mm | ||
| board thickness/hole size | ≤ 10:1 | |
| PCB Cover thickness Capacability | ||
| Solder mask Color | green, matte green,yellow,blue,red,black,matte black | |
| Solder mask thickness | Surface line≥10um | |
| surface line corner≥6um | ||
| surface board 10-25um | ||
| Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm | ||
| Legend Color | White, yellow, black | |
| Min height of legend | 0.70mm (28mil) | |
| Min width of legend | 0.15mm (6 mil) | |
| Blue Gel thickness | 0.2-1.5mm | |
| Blue Gel tolerance | +/-0.15mm | |
| Carbon print Thickness | 5-25um | |
| Carbon print Min space | 0.25mm | |
| Carbon print impedance | 200Ω | |